{"title":"Silicon MCMs for parallel computing applications","authors":"M. McLaren, I. Jamison","doi":"10.1109/ICWSI.1993.255267","DOIUrl":null,"url":null,"abstract":"Multichip module (MCM) technology is used in the design of large-scale, distributed memory, multiple-instruction, multiple-data (MIMD) processors. Two demonstrators have been selected for different applications within a parallel computer. The applications stress various aspects of the technology. The demonstrators are the design of high-performance processing nodes, and the construction of multistage switching networks. In both cases, implementations exist using conventional packaging technology, affording the opportunity to directly compare the performance of the solutions with respect to cost and various other design criteria.<<ETX>>","PeriodicalId":377227,"journal":{"name":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","volume":"35 Suppl 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1993.255267","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Multichip module (MCM) technology is used in the design of large-scale, distributed memory, multiple-instruction, multiple-data (MIMD) processors. Two demonstrators have been selected for different applications within a parallel computer. The applications stress various aspects of the technology. The demonstrators are the design of high-performance processing nodes, and the construction of multistage switching networks. In both cases, implementations exist using conventional packaging technology, affording the opportunity to directly compare the performance of the solutions with respect to cost and various other design criteria.<>