Model-Based Analysis of Single-Event Upset (SEU) Vulnerability of 6T SRAM Using FinFET Technologies

Semiu A. Olowogemo, Hao Qiu, B. Lin, W. H. Robinson, D. Limbrick
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Abstract

The modeling process, when validated with the experimental data, can be used for additional analysis of similar technologies without the expense of laser beam or heavy ion testing. This paper evaluates the vulnerability of SRAM cells to single-event upsets (SEUs) using the NCSU FreePDK 15-nm and the ASAP 7-nm Predictive PDK models. Due to scaling, SRAM cells designed and fabricated in advanced technologies have reduced critical node capacitances that make them more vulnerable to the sources of radiation because of the corresponding critical charge of the cell. The maximum threshold linear energy transfer (LET) without an upset in the 15-nm technology is approximately 6.3 times the maximum of the 7-nm technology. In addition, reducing the critical charge affects the soft error rate (SER). The estimated results were compared with previously published experimental data for validation.
基于模型的基于FinFET技术的6T SRAM单事件干扰(SEU)漏洞分析
当实验数据验证建模过程时,可以用于类似技术的附加分析,而无需激光束或重离子测试的费用。本文采用NCSU FreePDK 15-nm和ASAP 7-nm预测PDK模型评估了SRAM细胞对单事件扰动(seu)的脆弱性。由于缩放,采用先进技术设计和制造的SRAM电池降低了关键节点电容,由于电池的相应临界电荷,使得它们更容易受到辐射源的影响。15nm技术中无扰动的最大阈值线性能量传递(LET)大约是7nm技术的6.3倍。此外,降低临界电荷会影响软错误率(SER)。估计结果与先前发表的实验数据进行了比较,以进行验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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