{"title":"A multi-pronged approach to defect management","authors":"D. Paradis, R. Guldi, J. Lalena, J.W. Ritchison","doi":"10.1109/ISSM.1995.524363","DOIUrl":null,"url":null,"abstract":"This paper describes a comprehensive, three pronged approach to defect management combining the elements of continuous in-line monitoring, yield loss quantification, and short loop analysis. In-line monitoring provides both a historical defect baseline and a trigger for initiating corrective action in the event of out-of-control situations. Yield loss quantification involving conventional bit mapping or bin mapping partitions the yield loss by defect type and process level. Loop monitors relate trouble spots to root causes, providing a continuous measure of the progress of process and equipment improvement programs.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"91 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Symposium on Semiconductor Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.1995.524363","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes a comprehensive, three pronged approach to defect management combining the elements of continuous in-line monitoring, yield loss quantification, and short loop analysis. In-line monitoring provides both a historical defect baseline and a trigger for initiating corrective action in the event of out-of-control situations. Yield loss quantification involving conventional bit mapping or bin mapping partitions the yield loss by defect type and process level. Loop monitors relate trouble spots to root causes, providing a continuous measure of the progress of process and equipment improvement programs.