Area-I/O RDL routing for chip-package codesign considering regional assignment

Kun-Sheng Lin, H. Hsu, R. Lee, Hung-Ming Chen
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引用次数: 8

Abstract

Flip-Chip package provides high density I/Os and better performance in package size, signal/power integrety, and wirelength. Routing on its Re-Distribution Layer (RDL) is one of the most difficult stage in Flip-Chip packaging due to the increasing number of I/Os in modern VLSI designs. Area I/O can shorten the signal path and further increases the I/O density, but the design complexity is also higher. The Area I/O RDL routing problem is introduced in this paper, considering wirelength minimization and chip-package codesign. The proposed algorithm effectively solves the problem. 100% routability is guaranteed, from block ports to I/O pads and from I/O pads to bump pads. The authors propose the concept of regional assignment to evaluate the skew between bumps and balls. It leads the nets to route within neighbor sectors rather than the opposite sector. The experimental results, on 7 industrial designs, show that the router greatly minimizes bump-ball skew compared with [12], with reasonable extra wirelength.
考虑区域分配的芯片封装协同设计的区域i /O RDL路由
倒装芯片封装提供高密度I/ o和更好的性能在封装尺寸,信号/功率完整性和无线长度。由于现代VLSI设计中I/ o数量的增加,在其重新分配层(RDL)上的路由是倒装芯片封装中最困难的阶段之一。区域I/O可以缩短信号路径,进一步提高I/O密度,但设计复杂度也较高。本文介绍了一种考虑最小无线长度和芯片封装协同设计的区域I/O RDL路由问题。该算法有效地解决了这一问题。100%的可达性得到保证,从块端口到I/O垫,从I/O垫到碰撞垫。作者提出了区域分配的概念来评价球与球之间的偏度。它导致网络在相邻部门而不是相反部门内路由。在7个工业设计上的实验结果表明,与[12]相比,该路由器在合理的额外无线长度下极大地减少了磕磕磕撞的歪斜。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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