Single-chip integrated transmitters and receivers

L. Coldren, L. Johansson, M. Lu, A. Sivananthan, M. Rodwell
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引用次数: 2

Abstract

Active InP-based photonic ICs can be created with size, weight, power and stability as well as system performance metrics superior to discrete solutions in many situations. If produced in some volume, the cost can be much lower. Coherent approaches will be greatly improved by the use of Photonic Integration, and numerous sensor applications may be enabled in addition to higher-spectral-efficiency communications. Close integration of control/feedback electronics will be desirable in many future PIC applications - it is required for low-cost Optical Phase Locked Loop (OPLL) systems with conventional semiconductor lasers, but efficiency can be high. New high-volume (client) applications may emerge as low-cost, high performance PIC/EIC transmitter/receiver engines are developed - interconnect, computing, sensing, communication, etc. Active integrated Si-photonics is rapidly emerging, and many applications are being explored. Integrated PIC/EIC devices would appear to be compelling, but not on the horizon yet.
单片机集成的发射器和接收器
在许多情况下,基于有源inp的光子ic可以在尺寸、重量、功率和稳定性以及系统性能指标方面优于分立解决方案。如果批量生产,成本会低得多。相干方法将通过使用光子集成得到极大的改进,除了更高的频谱效率通信之外,还可以实现许多传感器应用。在许多未来的PIC应用中,控制/反馈电子器件的紧密集成将是可取的-它需要低成本的光学锁相环(OPLL)系统与传统的半导体激光器,但效率可以很高。随着低成本、高性能PIC/EIC发送/接收引擎的开发,新的大批量(客户端)应用可能会出现——互连、计算、传感、通信等。有源集成硅光子学正在迅速兴起,许多应用正在探索中。集成PIC/EIC设备似乎很有吸引力,但还没有出现在地平线上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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