Influence of Mechanical Stress in a Packaged Frequency-Modulated MEMS Accelerometer

Abstract

Frequency modulated accelerometers composed of two double-ended tuning fork (DETF) resonators on a differential configuration were characterized for their sensitivity to force applied to their package. Commonly, differential architectures are employed to cancel common-mode errors, such as the mechanical stress or temperature dependency. The device dependence to mechanical stress was experimentally measured for forces up to 15 N and a reduction of about 5.6 times was obtained on the differential measurement. Additionally, the silicon dies were glued to chip-carriers using two different glues with distinct properties, and their sensitivity to stress was compared. The effectiveness of a viscoelastic glue over an epoxy-based glue for stress decoupling was tested. Long-term measurements under constant force were experimentally performed and for a time period of approximately 100 min, the stress relaxation and creeping of the viscoelastic glue enabled the recovery to the initial output of the sensor.