Microstructure and Property of TiB2-Dispersed Cu-matrix Composites

Ji-soon Kim, J. Kum, E. Kang, D. Nguyen, Jin-Chun Kim, Y. Kwon
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引用次数: 1

Abstract

In the present work, the microstructure and properties of Cu-based composites with 4.5 vol.% dispersed TiB2 particles developed by a combined process of mechanical alloying (MA), self-propagate high temperature synthesis (SHS) and spark-plasma sintering (SPS) will be reported. The microstructure of the composites revealed that the TiB2 dispersoids with the particle size of smaller than 250 nm uniformly distributed in Cu matrix. The sintered samples obtained approximately 99% in relative density after sintering at 650 degC for 5 min. The fine dispersed TiB2 dispersoids in Cu matrix was the main reason to improve the mechanical properties of the composites. The hardness reached a value of 74 HRB. The result of tensile test showed that the ultimate tensile strength, yield strength and Young modulus increased from 187 MPa, 158 Mpa and 119 GPa for pure Cu to 485.7 MPa, 355.3 MPa and 157 GPa for the composites, whereas the electrical conductivity remained a high value of 83 % IACS. After soaking at 850, 900 and 950 degC, the hardness of composites decreased to 62, 61 and 55 HRB, respectively. The softening temperature was determined to be higher than 900 degC.
tib2分散cu基复合材料的组织与性能
本文报道了采用机械合金化(MA)、自扩散高温合成(SHS)和火花等离子烧结(SPS)相结合的方法制备的分散率为4.5% TiB2的cu基复合材料的显微组织和性能。复合材料的微观结构表明,粒径小于250 nm的TiB2分散体均匀分布在Cu基体中。在650℃烧结5 min后,烧结试样的相对密度达到99%左右。Cu基体中弥散的TiB2是提高复合材料力学性能的主要原因。硬度达到74 HRB。拉伸试验结果表明,复合材料的极限抗拉强度、屈服强度和杨氏模量从纯Cu的187 MPa、158 MPa和119 GPa提高到485.7 MPa、355.3 MPa和157 GPa,而电导率保持在83% IACS的高值。在850℃、900℃和950℃浸泡后,复合材料的硬度分别降至62、61和55 HRB。测定软化温度为900℃以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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