Light-controlled, electrochemical, anisotropic etching of silicon

R. Voss, H. Siedel, H. Baumgartel
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引用次数: 9

Abstract

The process of electrochemical silicon etching in alkaline solutions was found to depend on the illumination. Experiments in 30% KOH revealed that on p-type silicon light shifts the passivation potential towards more positive values, whereas on n-type samples this shift is in the negative direction. As a consequence, etching can be initiated by light on p-type silicon when a potential slightly above etch stop is chosen. Similarly, etching currently in progress can be stopped by light on n samples when a potential slightly below etch stop is chosen. These effects are expected to open up new possibilities for micromachining, such as light-controlled etching of n-Si membranes or light-induced anisotropy effects in p-Si.<>
硅的光控、电化学、各向异性蚀刻
发现在碱性溶液中电化学硅蚀刻的过程依赖于光照。在30% KOH条件下的实验表明,在p型硅样品上,光使钝化电位向更正的方向移动,而在n型样品上,这种移动是向负的方向移动。因此,当选择略高于蚀刻止点的电势时,p型硅上的光可以引发蚀刻。类似地,当选择略低于蚀刻止点的电势时,当前正在进行的蚀刻可以通过光照在n个样品上停止。这些效应有望为微加工开辟新的可能性,例如n-Si膜的光控蚀刻或p-Si的光诱导各向异性效应。
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