Numerical analysis for thermal field of susceptor in MOCVD reactor

Kuo-hung Ho, C. Hu, Tomi T. T. Li
{"title":"Numerical analysis for thermal field of susceptor in MOCVD reactor","authors":"Kuo-hung Ho, C. Hu, Tomi T. T. Li","doi":"10.1109/CSTIC.2015.7153470","DOIUrl":null,"url":null,"abstract":"A MOCVD process requires not only high heating efficiency, but also good temperature uniformity on susceptor surface. The most common material of susceptor is graphite, but the heating lifetime is very short. Instead, this work uses the SiC as susceptor material. It enhances both the lifetime and thermal conductivity. In the meantime, we also change the shape and structure of susceptor to improve the temperature uniformity on the surface. In addition, the gas flow rate and wall temperature will affect the temperature uniformity thus the analysis of thermal flow field is also included. By using above methods, the temperature uniformity of susceptor can improve about 45%.","PeriodicalId":130108,"journal":{"name":"2015 China Semiconductor Technology International Conference","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 China Semiconductor Technology International Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2015.7153470","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

A MOCVD process requires not only high heating efficiency, but also good temperature uniformity on susceptor surface. The most common material of susceptor is graphite, but the heating lifetime is very short. Instead, this work uses the SiC as susceptor material. It enhances both the lifetime and thermal conductivity. In the meantime, we also change the shape and structure of susceptor to improve the temperature uniformity on the surface. In addition, the gas flow rate and wall temperature will affect the temperature uniformity thus the analysis of thermal flow field is also included. By using above methods, the temperature uniformity of susceptor can improve about 45%.
MOCVD反应器中感受器热场数值分析
MOCVD工艺不仅要求热效率高,而且要求电纳表面温度均匀性好。最常用的材料是石墨,但其加热寿命很短。相反,这项工作使用碳化硅作为感受器材料。它提高了寿命和导热性。同时,我们还改变了感受器的形状和结构,以提高表面温度的均匀性。此外,气体流速和壁面温度也会影响温度均匀性,因此还包括热流场的分析。采用上述方法可使电纳温度均匀性提高45%左右。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信