W-Band GaN Receiver Components Utilizing Highly Scaled, Next Generation GaN Device Technology

A. Margomenos, A. Kurdoghlian, M. Micovic, K. Shinohara, H. Moyer, D. Regan, R. Grabar, C. Mcguire, M. Wetzel, D. Chow
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引用次数: 14

Abstract

We report the first W-band GaN receiver components using a next generation, highly scaled GaN device technology. This technology (40nm, fT= 220 GHz, fmax= 400 GHz, Vbrk > 40V) enables receiver components that meet or exceed performance reported by competing device technologies while maintaining > 5x higher breakdown voltage, higher linearity, dynamic range and RF survivability. This paper includes results for a 4 and a 5 stage low noise amplifier (LNA) (gain over 5 dB/stage at 110 GHz), a single-pole single-throw (SPST) and a single-pole double-throw (SPDT) switch with loss of 0.9 dB and 1.3 dB respectively and a reflective type phase shifter
w波段氮化镓接收器组件,采用高度规模化的下一代氮化镓器件技术
我们报告了第一个使用下一代高规模GaN器件技术的w波段GaN接收器组件。该技术(40nm, fT= 220 GHz, fmax= 400 GHz, Vbrk > 40V)使接收器组件能够达到或超过竞争设备技术所报告的性能,同时保持> 5倍的高击穿电压,更高的线性度,动态范围和RF生存性。本文包括4级和5级低噪声放大器(LNA) (110 GHz时增益超过5 dB/级)、单极单掷(SPST)和单极双掷(SPDT)开关(损耗分别为0.9 dB和1.3 dB)以及反射型移相器的结果
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