Density aware interconnect parasitic estimation for mixed signal design

Hui Ying Foo, Kevin Wei Chung Leong, R. Mohd-Mokhtar
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引用次数: 3

Abstract

With the current advancement of the design technology process, the contribution of interconnects parasitic to critical path delays has become crucial in determining the overall chip performance. A reliable parasitic estimation tool can help in assisting the design decisions as well as enabling a more precise synthesis; minimizing the tedious repetitive design cycles of placement and routing process. Experiments show that different interconnects estimation algorithms produce different parasitic RC values. To achieve an accurate parasitic capacitance prediction, several approaches were investigated and a new methodology of estimation is proposed. The new algorithm performs estimation prior to layout. It modifies the conventional estimation methodology by taking into account the layout density specification for a more precise interconnects parasitic capacitance estimation. The algorithm is divided into two stages; the pre-layout routing estimation and the generation of interconnect parasitic values. The layout density specification is brought into consideration on the second phase of the estimation process. The accuracy of the approximation is determined by comparing the estimated results with the actual post-layout data. The final outcome is positive, showing a good correlation between the pre-layout and post-layout measures; varying within 10 percent of the final extracted values.
混合信号设计中密度感知互连寄生估计
随着当前设计技术进程的进步,互连寄生对关键路径延迟的贡献已经成为决定芯片整体性能的关键。一个可靠的寄生估计工具可以帮助辅助设计决策以及实现更精确的综合;最大限度地减少繁琐的重复设计周期的安置和布线过程。实验表明,不同的互连估计算法产生不同的寄生RC值。为了实现准确的寄生电容预测,研究了几种方法,并提出了一种新的估计方法。新算法在布局之前进行估计。它修改了传统的估计方法,考虑到更精确的互连寄生电容估计的布局密度规范。该算法分为两个阶段;预布局路由估计和互连寄生值的产生。在评估过程的第二阶段,会考虑布局密度规格。通过将估计结果与布置后的实际数据进行比较来确定近似的准确性。最终结果为正,表明布局前和布局后措施之间存在良好的相关性;在最终提取值的10%范围内变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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