Dual-Mode High-Speed Data Transmission Using Substrate Integrated Waveguide Interconnects

Abstract

The enclosed volume by a substrate integrated waveguide interconnect is re-utilized to increase the channel capacity. A stripline is embedded inside the waveguide, thus a dual-mode or hybrid interconnect structure is created. Isolation and transmission characteristics of the two signal channels are evaluated by fullwave simulations. Measurements of the fabricated prototype demonstrate that the hybrid platform handles an aggregate data rate of 8.5 Gb/s.