Electromagnetic simulation of a test board to support system in package testing

Abstract

A model of a printed circuit board used to test an RF receiver system in package (SiP) is presented. A single 3D EM model can be created for the SMA, printed circuit test board, and package socket mount. The model gives a superior match to measured data compared to a lumped element equivalent circuit. The model provides a full two-port network where a direct measurement cannot be made.