Impact of BOX thickness and ground-plane on non-linearity of UTBB FD-SOI MOS transistors

Mandar S. Bhoir, N. Mohapatra
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引用次数: 2

Abstract

This work investigates, for the first time, the impact of BOX thickness (Tbox) and Ground-plane (GP) on the non-linearity of transistors fabricated using UTBB FD-SOI CMOS technology. By extracting 2nd and 3rd order harmonic distortions, we have shown that the TBOX scaling and GP improve the transistor linearity at lower drain currents (low-power applications) in advanced FD-SOI technology nodes. The physics behind this observation i.e the additional mobility limiting factors, is explained in detail by using well calibrated TCAD simulations.
BOX厚度和接地平面对UTBB FD-SOI MOS晶体管非线性的影响
本文首次研究了盒厚度(Tbox)和地平面(GP)对采用UTBB FD-SOI CMOS技术制造的晶体管非线性的影响。通过提取二阶和三阶谐波失真,我们已经证明TBOX缩放和GP在先进FD-SOI技术节点中提高了低漏极电流(低功耗应用)下的晶体管线性度。通过使用校准良好的TCAD模拟,详细解释了这一观察结果背后的物理原理,即额外的迁移限制因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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