Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade

Abstract

Technological solutions for the transfer to large area microstrip radiation silicon sensors are presented for the upgrade of the ATLAS detector. A new Automatic Layout Generation Tool has been developed to easily adapt the design of the sensors, investigating also the fabrication processes involved in 6-inch wafer technology. Inter-strip and radiation hardness characterization of prototype sensors is presented, showing an agreement with the new specifications. Embedded Pitch Adaptor concept is studied as a solution for the sensor/readout interconnection for the forthcoming ATLAS Upgrade.