Heat slug attach: a cyanate ester based solution

Abstract

Today's leading-edge integrated circuits are driven by higher performance requirements, including faster operating speeds and enhanced power dissipation. These requirements create a need for thermal management. To address this need, cyanate ester (CE) based materials, commonly used in semiconductor die attach applications, can now be used to attach heat slugs to laminate packages. While other technologies, including epoxy films and solders remain viable alternatives, CE pastes provide several process advantages such as long pot life, quick-cure capability and improved process flexibility.