Passive Silicon Carrier High Performance Package for VLSI

Abstract

A silion-on-silicon package for 9 VLSI chips is presented. The carrier is especially designed to support the high frequency current surges of complementary logic like CMOS or BICMOS. It contains integrated decoupling capacitors and uses 3 layers of metal. The chips are mounted via `controlled collapse chip connection'. A /370 processor containing 9 CMOS chips has been assembled. Functionality and manufacturability have successfully been demonstrated.