A practical statistical technique to improve seal integrity and reliability of microelectronic packages

1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319) Pub Date : 1997-10-13 DOI:10.1109/IRWS.1997.660302

T.R. Narasimhan, E. Trotter

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引用次数: 2

Abstract

This paper presents insights into the variability of the functionality, quality and reliability characteristics of hermetically sealed packages for electronic applications. Process characterization and analysis methods are shown on packages from a true production environment. The concept of statistical models and filtering is given to depict the output variables (leak rate, residual gas analysis) and to define process leak limits derived from characterization instead of arbitrary limits set by military standards. Process monitoring (SPC) via statistical charts (standard deviation and median) maintains the on-going control. The leak limit set by process control totally eliminates fluid ingress in packages and moisture related corrosion failures compared to fixed military standard limits. This statistical technique is easy to implement and has potential usefulness in new applications such as assessing new methods and configurations of hermetically sealed enclosures. By preventing moisture induced corrosion, long term reliability is improved significantly.

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提高微电子封装密封完整性和可靠性的实用统计技术

本文介绍了对电子应用中密封式封装的功能、质量和可靠性特性的可变性的见解。过程表征和分析方法显示在包装从一个真实的生产环境。给出了统计模型和滤波的概念，以描述输出变量(泄漏率，残余气体分析)，并定义由表征得出的过程泄漏限值，而不是由军事标准设定的任意限值。过程监控(SPC)通过统计图表(标准差和中位数)维持持续控制。与固定的军用标准限制相比，由过程控制设定的泄漏限制完全消除了流体进入包装和与水分相关的腐蚀故障。这种统计技术易于实现，并且在评估密封外壳的新方法和配置等新应用中具有潜在的用途。通过防止湿气腐蚀，显著提高了设备的长期可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)

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