Validation of a functional principle for a broadband millimeter-wave power detection structure in a recent BiCMOS technology

F. Trenz, R. Weigel, D. Kissinger
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引用次数: 1

Abstract

In this paper, a functional principle for a broadband thermal detector suited for a monolithical integration is shown. Two tantalum load resistors are heated by an input signal, while the temperature at a fixed distance is recorded on chip with a differential temperature sensing bridge. An integrated differential to single-ended stage amplifies the bridges differential voltage and provides an output voltage proportional to the input power of the detector. The thermal resistance and capacitance between the load resistor and the sensing cell act as a low pass filter in the electrical regime. Based on this concept, a detector chip has been designed, which has been analyzed in thermal simulations. The realized detector has been characterized on-chip and bonded to a microwave substrate for a system performance estimation. Its input impedance is tuned to 50 Ohms and measured matching is better than −15 dB from 150MHz to 110 GHz. With a low supply voltage of 1.5V and its active area of around 80×36µm2, the detector is suitable for an integrated power measurement solution.
最新BiCMOS技术中宽带毫米波功率检测结构的功能原理验证
本文介绍了适用于单片集成的宽带热探测器的功能原理。通过输入信号加热两个钽负载电阻,通过差温感应桥将固定距离的温度记录在芯片上。集成的差分到单端级放大桥的差分电压,并提供与检测器输入功率成比例的输出电压。负载电阻和传感单元之间的热电阻和电容在电状态下充当低通滤波器。在此基础上,设计了一种探测器芯片,并进行了热模拟分析。所实现的探测器已在片上进行了表征,并粘接在微波衬底上进行了系统性能评估。其输入阻抗调谐至50欧姆,在150MHz至110ghz范围内的测量匹配优于- 15 dB。该检测器具有1.5V的低电源电压,其有效面积约为80×36µm2,适用于集成功率测量解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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