Polylithic integration of SAW devices using quartz-on-silicon process for true single chip radio

Yeonwoo Ku, Y. Eo, K. Lee
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Abstract

Presents the performance of DTCSO (digitally temperature-compensated SAW oscillator) using PLIC (polylithic integrated circuit) technology on quartz-on-silicon wafer. A prototype DTCSO reference oscillator is designed and fabricated on a QoS wafer and shows the phase noise performance -115 dBc/Hz at 10 kHz offset, 7.5 mW power consumption. The frequency stability performance of 4.5 ppm is very comparable with that of bulk crystal TCXO, demonstrating the feasibility of integration of reference oscillator for high performance true single chip radio.
使用石英硅片工艺的SAW器件的多片集成,用于真正的单芯片无线电
介绍了在硅基石英晶片上采用PLIC(多晶集成电路)技术的数字温度补偿SAW振荡器的性能。在QoS晶圆上设计并制作了原型DTCSO参考振荡器,其相位噪声性能为-115 dBc/Hz,偏移量为10 kHz,功耗为7.5 mW。4.5 ppm的频率稳定性能与体晶TCXO相当,证明了集成参考振荡器实现高性能真单芯片无线电的可行性。
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