Effects of Sb on SnAgCu lead-free solder

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI:10.1109/IEMT.2008.5507895

K. Cheong, M. C. Ng, A. B. Ismail, L. B. Hussain

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引用次数: 1

Abstract

This research work investigates the effect of 0.5 wt%, 1.0 wt% and 1.5 wt% Sb addition in 96.8 wt% Sn 2.5 wt% Ag 0.7 wt% Cu. Addition of Sb has shown significant effect on metallography, wettability (using ZnCl2 as flux), thermal properties as well as mechanical properties of the SnAgCu solder. The wettability test has been carried out using Cu as substrate by varying the solder temperature. A good wettability profile has been obtained at 280°C. Differential scanning calorimetry and thermogravimetric analysis have been performed on the solders to determine the melting temperature, melting behaviour and thermal stability of the solders. Results show that Sb addition has not reduced the melting temperature of SnAgCu. The solders show no significant weight loss after heating up to 300°C. Tensile and shear tests have been carried out on soldered copper substrates and all of the solders tested show a ductile fracture mode. The strength of the solder joint is actually a competition in between the ductility of the solder and also the percentage of voids formed in the joint.

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Sb对SnAgCu无铅焊料的影响

本文研究了在96.8 wt% Sn、2.5 wt% Ag、0.7 wt% Cu中添加0.5 wt%、1.0 wt%和1.5 wt% Sb的效果。添加Sb对SnAgCu钎料的金相、润湿性(以ZnCl2为助焊剂)、热性能和力学性能都有显著影响。以铜为衬底，通过改变焊料温度进行了润湿性试验。在280℃下获得了良好的润湿性。采用差示扫描量热法和热重法对焊料进行了分析，确定了焊料的熔化温度、熔化行为和热稳定性。结果表明Sb的加入并没有降低SnAgCu的熔化温度。焊料在加热到300°C后没有明显的重量损失。在铜基体上进行了拉伸和剪切试验，所有试验的焊料都显示出韧性断裂模式。焊点的强度实际上是焊料的延展性和在接头中形成的空隙百分比之间的竞争。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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