Innovative reliability solution for WLCSP packages

Abstract

This paper presents a reliability handling innovation for WLCSP product qualification. It improves reliability flow compared with standard chip board (CB) assembled WLCSP solutions. Evidence demonstrates that the concept works across a complete range of reliability stress conditions. Results with the new reliability proposal are confirmed to be similar to other standard CB solutions. This is verified through a full qualification plan on three diffusion lots using reliability trials under different environmental and bias conditions.