A. Pudov, M. Gloeckler, S. Demtsu, J. Sites, K. Barth, R. A. Enzenroth, W. Sampath
{"title":"Effect of back-contact copper concentration on CdTe cell operation","authors":"A. Pudov, M. Gloeckler, S. Demtsu, J. Sites, K. Barth, R. A. Enzenroth, W. Sampath","doi":"10.1109/PVSC.2002.1190676","DOIUrl":null,"url":null,"abstract":"CdTe solar cells were fabricated with five different concentrations of copper, including zero, used in back-contact formation. Room-temperature J-V curves showed progressive deterioration in fill factor with reduced copper. J/sub SC/ and QE were similar for all Cu-levels. Capacitance measurement suggested enhanced intermixing at the back contact with copper present. Photocurrent mapping was much less uniform for reduced-Cu cells. Elevated-temperature stress induced very little change in J-V when sufficient Cu was used in the contact.","PeriodicalId":177538,"journal":{"name":"Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002.","volume":"323 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC.2002.1190676","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20
Abstract
CdTe solar cells were fabricated with five different concentrations of copper, including zero, used in back-contact formation. Room-temperature J-V curves showed progressive deterioration in fill factor with reduced copper. J/sub SC/ and QE were similar for all Cu-levels. Capacitance measurement suggested enhanced intermixing at the back contact with copper present. Photocurrent mapping was much less uniform for reduced-Cu cells. Elevated-temperature stress induced very little change in J-V when sufficient Cu was used in the contact.