Shelf Packing to the Design and Optimization of A Power-Aware Multi-Frequency Wrapper Architecture for Modular IP Cores

Dan Zhao, Unni Chandran, H. Fujiwara
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引用次数: 9

Abstract

This paper proposes a novel power-aware multi-frequency wrapper architecture design to achieve at-speed testability. The trade-offs between power dissipation, scan time and bandwidth are well handled by gating off certain virtual cores at a time while parallelizing the remaining. A shelf packing based optimization algorithm is proposed to design and optimize the wrapper architecture while minimizing the test time under power and bandwidth constraints.
模块化IP核的功耗感知多频封装架构设计与优化
本文提出了一种新的功率感知多频封装体系结构设计,以实现高速可测试性。功耗、扫描时间和带宽之间的权衡可以通过门控一次关闭某些虚拟核,同时并行处理其余的虚拟核来很好地处理。提出了一种基于货架包装的优化算法,在功率和带宽限制下,设计和优化包装体系结构,同时最小化测试时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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