Gate-all-around NWFETs vs. triple-gate FinFETs: Junctionless vs. extensionless and conventional junction devices with controlled EWF modulation for multi-VT CMOS

Abstract

We report a comprehensive evaluation of different device architectures from a device and circuit performance viewpoint: gate-all-around (GAA) nanowire (NW) FETs vs. triple-gate finFETs, both built using various doping schemes. GAA devices are obtained via a fins release process, high density compatible, at replacement metal gate (RMG) module, and outperform others per footprint. Junctionless (JL) GAA-NWFETs with excellent electrostatics and smaller IOFF values yield ring oscillators (RO) with substantially lower power dissipation and considerably longer BTI lifetime. Improved reliability is also obtained for extensionless vs. reference FETs with conventional junctions, at comparable device and circuit performance. In addition, a TiAl-based EWF-metal is introduced for the first time in a GAA configuration resulting in higher performing, low-VT, n-type GAA-NWFETs and single-MG 6T-SRAM cells. Noise results show no significant impact of device architecture on gate stack integrity and some benefit for JL and TiAl-based GAA-NWFETs.