Impact of well edge proximity effect on timing

T. Kanamoto, Y. Ogasahara, Keiko Natsume, Kenji Yamaguchi, H. Amishiro, Tetsuya Watanabe, M. Hashimoto
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引用次数: 10

Abstract

This paper studies impact of the well edge proximity effect on digital circuit delay, based on model parameters extracted from test structures in an industrial 65 nm wafer process. The experimental results show that up to 10% of delay increase arises by the well edge proximity effect in the 65 nm technology, and it depends on interconnect length. Furthermore, due to asymmetric increase in pMOS and nMOS threshold voltages, delay may decrease in spite of the threshold voltage increase. From these results, we conclude that considering WPE is indispensable to cell characterization in the 65 nm technology.
井边接近效应对井时的影响
本文基于从工业65纳米晶圆工艺中提取的测试结构模型参数,研究了井边邻近效应对数字电路延迟的影响。实验结果表明,在65nm技术中,井边接近效应导致的延迟增加可达10%,且与互连长度有关。此外,由于pMOS和nMOS阈值电压的不对称增加,延迟可能会随着阈值电压的增加而减小。从这些结果中,我们得出结论,考虑WPE对于65nm技术中的细胞表征是必不可少的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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