High frequency capacitive micromechanical resonators with reduced motional resistance using the HARPSS technology

S. Pourkamali, Farrokh Ayazi
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引用次数: 32

Abstract

The paper reports on the implementation and characterization of thick bulk mode VHF capacitive disk resonators with reduced motional resistance. Single crystal silicon (SCS) side-supported disk resonators with thickness of 18 /spl mu/m and 10 /spl mu/m and capacitive gaps of 160 nm and 75 nm, respectively (gap aspect-ratio>130), are fabricated on silicon-on-insulator substrates using a 3-mask HARPSS-on-SOI process. Over 20/spl times/ lower motional resistance and larger signal-to-noise ratio compared to the previous thin VHF SCS resonators is demonstrated, resulting from the new resonator design with increased number of electrodes and larger device thickness. Quality factors in the order of 30,000 to 50,000 at resonant frequencies of 150-230 MHz are demonstrated for the thick disk resonators. The measured data is in excellent agreement with the theoretical values.
高频电容微机械谐振器,采用HARPSS技术降低运动电阻
本文报道了降低运动电阻的厚体模甚高频容性圆盘谐振器的实现和特性。采用3掩模HARPSS-on-SOI工艺,在硅-绝缘体衬底上制备了厚度分别为18 /spl mu/m和10 /spl mu/m、电容间隙分别为160 nm和75 nm(间隙宽高比>130)的单晶硅(SCS)侧支圆盘谐振器。由于新的谐振器设计增加了电极数量和更大的器件厚度,与以前的超薄VHF SCS谐振器相比,证明了超过20/spl倍/更低的运动电阻和更大的信噪比。在150-230 MHz的谐振频率下,厚盘谐振器的质量因子为30,000至50,000。实测数据与理论值非常吻合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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