An Application Specific Processor Architecture with 3D Integration for Recurrent Neural Networks

Sumon Dey, P. Franzon
{"title":"An Application Specific Processor Architecture with 3D Integration for Recurrent Neural Networks","authors":"Sumon Dey, P. Franzon","doi":"10.1109/ISQED.2019.8697413","DOIUrl":null,"url":null,"abstract":"Deep learning using recurrent neural networks has broadened the horizon of artificial intelligence. It can process a massive amount of multimodal natural data (video, audio) and learn useful join representations in various applications. However, implementation of recurrent neural networks in hardware and learn representations requires high throughput and memory bandwidth of that hardware platform. This work offers a 3D hardware architecture with application-specific instruction set processor, 3D-stacked memory, and sized on-chip memory for training and inference of recurrent neural networks. It also implemented a set of short instructions after analyzing different complex, time-consuming, special operations into high-level function blocks. The accelerator also performed state-of-the-art mixed precision training using custom instructions. A high-level programming environment is developed to generate Very Long Instruction Word (VLIW) instructions for this accelerator and processed a popular and successful variant of the recurrent neural network. At 28nm, this work achieved 8.5 x processing speedup, 47.5 x energy efficiency per sequence, and 2.71 x reduction in silicon area against a GPU.","PeriodicalId":128327,"journal":{"name":"20th International Symposium on Quality Electronic Design (ISQED)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"20th International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2019.8697413","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Deep learning using recurrent neural networks has broadened the horizon of artificial intelligence. It can process a massive amount of multimodal natural data (video, audio) and learn useful join representations in various applications. However, implementation of recurrent neural networks in hardware and learn representations requires high throughput and memory bandwidth of that hardware platform. This work offers a 3D hardware architecture with application-specific instruction set processor, 3D-stacked memory, and sized on-chip memory for training and inference of recurrent neural networks. It also implemented a set of short instructions after analyzing different complex, time-consuming, special operations into high-level function blocks. The accelerator also performed state-of-the-art mixed precision training using custom instructions. A high-level programming environment is developed to generate Very Long Instruction Word (VLIW) instructions for this accelerator and processed a popular and successful variant of the recurrent neural network. At 28nm, this work achieved 8.5 x processing speedup, 47.5 x energy efficiency per sequence, and 2.71 x reduction in silicon area against a GPU.
用于循环神经网络的具有三维集成的特定应用处理器体系结构
使用递归神经网络的深度学习拓宽了人工智能的视野。它可以处理大量的多模态自然数据(视频、音频),并在各种应用程序中学习有用的连接表示。然而,在硬件和学习表征中实现递归神经网络需要该硬件平台的高吞吐量和内存带宽。这项工作提供了一个3D硬件架构,具有特定于应用程序的指令集处理器,3D堆叠存储器和用于循环神经网络训练和推理的大小片上存储器。它还在将各种复杂、耗时、特殊的操作分析成高级功能块后实现了一组简短的指令。加速器还使用定制指令进行了最先进的混合精确训练。开发了一个高级编程环境来生成该加速器的超长指令词(VLIW)指令,并处理了一种流行且成功的递归神经网络变体。在28nm,这项工作实现了8.5倍的处理加速,每个序列的能量效率为47.5倍,与GPU相比,硅面积减少了2.71倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书