Respective parts of capacitive and inductive coupling

D. Deschacht
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引用次数: 0

Abstract

Rapid progress in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. In this paper we show the influence of inductance on crosstalk voltage by considering a configuration of two parallel coupled interconnects. For a typical DSM (deep-sub-micron) geometry structure for data buses, we show that when standard distributed RC models are used and inductive effects are ignored, large errors can occur in the prediction and evaluation of the crosstalk voltage. This is all the more important because the inductance effect will increase as technologies downscale. For our structure, the inductive part of crosstalk can reach 30% when the input transition time at the beginning of the aggressor line is 50ps. The sensibility of inductances values, including self and mutual inductances are then analysed.
电容耦合和电感耦合各部分
集成电路技术的飞速发展使得数字芯片的开关速度不断提高。因此,人们对与信号线相关的电感越来越感兴趣。本文通过考虑两个并联耦合互连的结构,展示了电感对串扰电压的影响。对于典型的DSM(深亚微米)数据总线几何结构,我们表明,当使用标准的分布式RC模型并且忽略电感效应时,串扰电压的预测和评估可能会出现很大的误差。这一点尤为重要,因为电感效应将随着技术的小型化而增加。对于我们的结构,当侵略线起始的输入跃迁时间为50ps时,串扰的感应部分可以达到30%。然后分析了电感值的敏感性,包括自电感和互感。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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