{"title":"Respective parts of capacitive and inductive coupling","authors":"D. Deschacht","doi":"10.1109/SPI.2005.1500934","DOIUrl":null,"url":null,"abstract":"Rapid progress in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. In this paper we show the influence of inductance on crosstalk voltage by considering a configuration of two parallel coupled interconnects. For a typical DSM (deep-sub-micron) geometry structure for data buses, we show that when standard distributed RC models are used and inductive effects are ignored, large errors can occur in the prediction and evaluation of the crosstalk voltage. This is all the more important because the inductance effect will increase as technologies downscale. For our structure, the inductive part of crosstalk can reach 30% when the input transition time at the beginning of the aggressor line is 50ps. The sensibility of inductances values, including self and mutual inductances are then analysed.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2005.1500934","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Rapid progress in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. In this paper we show the influence of inductance on crosstalk voltage by considering a configuration of two parallel coupled interconnects. For a typical DSM (deep-sub-micron) geometry structure for data buses, we show that when standard distributed RC models are used and inductive effects are ignored, large errors can occur in the prediction and evaluation of the crosstalk voltage. This is all the more important because the inductance effect will increase as technologies downscale. For our structure, the inductive part of crosstalk can reach 30% when the input transition time at the beginning of the aggressor line is 50ps. The sensibility of inductances values, including self and mutual inductances are then analysed.