An Improved Analysis Method on Si-Photonics Waveguide Sidewall Roughness

H. Tan, Xintong Zhu, P. Ang, Yuzhe Zhao, K. Menon, Yanlin Pan, C. Chen, P. K. Tan
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引用次数: 0

Abstract

Low propagation loss waveguides are always preferred when making Si-photonics waveguide devices. However, light scattering due to sidewall roughness of waveguide contributes to the majority of signal losses. To reduce the loss, a reliable approach to measure the sidewall roughness is critical to fine-tune the fabrication process. In this paper, we report a direct sidewall roughness measurement method by using Atomic Force Microscopy (AFM) incorporated with a special scanning mode (Peakforce Tapping mode) and a point-terminated probe. This method has been successfully applied to measure the sidewall roughness of Si-Photonics waveguides for production process monitoring. The present method can also be applied to characterize the sidewall roughness of other nanostructures with similar requirements or situations.
一种改进的硅光子波导侧壁粗糙度分析方法
低传播损耗波导是硅光子学波导器件的首选。然而,由于波导侧壁粗糙度引起的光散射是造成大部分信号损失的原因。为了减少损耗,一种可靠的测量侧壁粗糙度的方法对于微调制造过程至关重要。在本文中,我们报告了一种使用原子力显微镜(AFM)结合特殊扫描模式(峰值力攻丝模式)和点端探针直接测量侧壁粗糙度的方法。该方法已成功地应用于硅光子波导侧壁粗糙度的测量,用于生产过程监控。本方法也可应用于具有类似要求或情况的其他纳米结构的侧壁粗糙度表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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