17 GHz receiver in TSLP package for WLAN/ISM applications in 0.13 /spl mu/m CMOS

Abstract

This work presents a fully integrated CMOS receiver in a leadless plastic package (TSLP) for high data rate WLAN applications at 17.2 GHz ISM band. The receiver offers a gain of 35 dB, input 1dB compression point of -49.6 dBm, SSB noise figure of 9.9 dB and an input IP3 of -39.8 dBm. At a power supply of 1.5 V, the receiver, which includes LNA, complex demodulator, VCO, IQ-divider and all RF-buffers, consumes only 245 mW.