V. A. Gridchin, V. Grischenko, V. M. Lubimsky, A. Shaporin, J. Lee
{"title":"Design features for high pressure transducers","authors":"V. A. Gridchin, V. Grischenko, V. M. Lubimsky, A. Shaporin, J. Lee","doi":"10.1109/MIAME.1999.827843","DOIUrl":null,"url":null,"abstract":"In this experimental work the polysilicon pressure transducers are designed with pressure-sensitive elements and made for pressures over 5 MPa. To determine the magnitude of mechanical stress in the diaphragm, we defined gauge factors from longitudinal and transverse piezoresistors on the console beam made from the same wafer as the diaphragm. Also, we made a model for mechanical stress in the diaphragm by the finite element method (FEM) by taking into account not only the uniformly distributed load on the plate of the diaphragm, but also the load on the lateral side of the diaphragm. The comparison of the calculated mechanical stress with the experimentally defined one has shown a coincidence within 20% error bound.","PeriodicalId":132112,"journal":{"name":"Proceedings of the IEEE - Russia Conference. 1999 High Power Microwave Electronics: Measurements, Identification, Applications. MIA-ME'99 (Cat. No.99EX289)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-09-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE - Russia Conference. 1999 High Power Microwave Electronics: Measurements, Identification, Applications. MIA-ME'99 (Cat. No.99EX289)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MIAME.1999.827843","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this experimental work the polysilicon pressure transducers are designed with pressure-sensitive elements and made for pressures over 5 MPa. To determine the magnitude of mechanical stress in the diaphragm, we defined gauge factors from longitudinal and transverse piezoresistors on the console beam made from the same wafer as the diaphragm. Also, we made a model for mechanical stress in the diaphragm by the finite element method (FEM) by taking into account not only the uniformly distributed load on the plate of the diaphragm, but also the load on the lateral side of the diaphragm. The comparison of the calculated mechanical stress with the experimentally defined one has shown a coincidence within 20% error bound.