Systematic study on bias temperature instability of various high-k gate dielectrics ; HfO2, HfZrxOy and ZrO2

H. Jung, T. Park, Jeong Hwan Kim, Sang Young Lee, Joohwi Lee, Himchan Oh, Kwang Duck Na, Jung-min Park, Weon-hong Kim, Min-woo Song, N. Lee, C. Hwang
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引用次数: 6

Abstract

HfO2, HfZrxOy and ZrO2 gate dielectrics are systematically compared in terms of the nMOS PBTI and pMOS NBTI. Compared to HfO2, ZrO2 exhibits higher capacitance and superior nMOS mobility characteristics. In addition, as the ZrO2 content increases, Vth shift under the nMOS PBTI stress is dramatically reduced. This is mainly contributed to the lower density of pre-existing bulk traps related to the oxygen vacancies.
系统研究了各种高k栅极介质的偏置温度不稳定性HfO2, HfZrxOy和ZrO2
对HfO2、HfZrxOy和ZrO2栅极介质进行了nMOS PBTI和pMOS NBTI的系统比较。与HfO2相比,ZrO2具有更高的电容和优异的nMOS迁移特性。此外,随着ZrO2含量的增加,nMOS PBTI应力下的Vth位移显著减小。这主要是由于与氧空位有关的预先存在的体阱密度较低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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