Plenary speech

S. Akejima
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引用次数: 7

Abstract

Heterogeneous Integration Application autonomous vehicle, IoTs, and big data. The system-technology drivers This talk will review innovations in SiP technologies – Flip-Chip, Fan-Out, embedded and beyond, describing how these promises are fulfilled for achieving higher bandwidth, small form factor, with increased functionality and mixed wafer nodes, so very comprehensive Heterogenous Integration and Homogeneous Integration technologies for the AIoT, 5G and data center application.
全体的演讲
异构集成应用:自动驾驶汽车、物联网、大数据。本演讲将回顾SiP技术的创新-倒装芯片,扇出,嵌入式和超越,描述如何实现这些承诺,以实现更高的带宽,小尺寸,增加的功能和混合晶圆节点,因此非常全面的异构集成和同构集成技术的AIoT, 5G和数据中心应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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