{"title":"Plenary speech","authors":"S. Akejima","doi":"10.1109/hpcsim.2014.6903660","DOIUrl":null,"url":null,"abstract":"Heterogeneous Integration Application autonomous vehicle, IoTs, and big data. The system-technology drivers This talk will review innovations in SiP technologies – Flip-Chip, Fan-Out, embedded and beyond, describing how these promises are fulfilled for achieving higher bandwidth, small form factor, with increased functionality and mixed wafer nodes, so very comprehensive Heterogenous Integration and Homogeneous Integration technologies for the AIoT, 5G and data center application.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 3rd IEEE CPMT Symposium Japan","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/hpcsim.2014.6903660","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Heterogeneous Integration Application autonomous vehicle, IoTs, and big data. The system-technology drivers This talk will review innovations in SiP technologies – Flip-Chip, Fan-Out, embedded and beyond, describing how these promises are fulfilled for achieving higher bandwidth, small form factor, with increased functionality and mixed wafer nodes, so very comprehensive Heterogenous Integration and Homogeneous Integration technologies for the AIoT, 5G and data center application.