A PCB based package with thermal resistance improvement

Abstract

This paper describes an improvement technique of the interconnection between a die and top and bottom copper layer in a PCB. By multiplying laser drilling steps, the amount of copper in the interconnection is increased, as well as the heat transfer performances. Therefore, it makes this technique suitable for high power applications. For a fair comparison, various copper densities are proposed and analyzed. Thermal measurements are carried out to benchmark the different solutions and a comparison with analytical calculations is performed to corroborate and define the sensitivity of various parameters for further improvements.