{"title":"Optical interconnects & nanophotonics","authors":"B. Offrein","doi":"10.1109/OMEMS.2008.4607808","DOIUrl":null,"url":null,"abstract":"Optical interconnect technology will play an increasingly important role in servers and supercomputers. High density and low-cost optical packaging concepts are required. We consider optical interconnects for board-level and chip-level communication.","PeriodicalId":402931,"journal":{"name":"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMEMS.2008.4607808","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Optical interconnect technology will play an increasingly important role in servers and supercomputers. High density and low-cost optical packaging concepts are required. We consider optical interconnects for board-level and chip-level communication.