Substrate integrated common mode choke of EMI filter for high speed serial link

Abstract

A miniaturized substrate integrated common mode chock of EMI filter is presented for high speed serial link. This novel design is implemented on a high density interconnect board. The small size of the component makes it well suitable for system integration and assembly in a highly compact situation. The common mode noise is significantly mitigated according to the post-fabrication spectrum analyses. Good agreement between simulation and measurement is reached and observed.