{"title":"Electronics Manufacturing Research At Rensselaer Polytechnic Institute","authors":"D. Millard, D. Knorr, L. Felton, S. Black","doi":"10.1109/IEMT.1992.639882","DOIUrl":null,"url":null,"abstract":"The 1990's has become the decade of electronics manufacturing. Never before has electronics been as major an element of nearly every product sector. For example, a 1992 automobile contains solid state ignition, computer-controlled fuel injection, automatic anti-skid braking, embedded diagnostics and other electronic components that were never even thought of by 1960's auto manufacturers -making the exponential increase and metamorphosis in electronics manufacturing quite clear. The never-ending desire for greater functionality and higher performance associated with electronics has forced designers to utilize novel, high density packaging technologies to provide theiI products with a competitive edge. Unfortunately, the use of an immature device packaging technology provides those responsible for manufacture of the electronics with an assembly and reliability related nightmare. The predominance of today's devices are being connected to substrates exhibiting .025\" (25mil) pitch density or less. As can be seen in the following figure, this trend will continue to get worse as we approach the year 2000 [l].","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1992.639882","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The 1990's has become the decade of electronics manufacturing. Never before has electronics been as major an element of nearly every product sector. For example, a 1992 automobile contains solid state ignition, computer-controlled fuel injection, automatic anti-skid braking, embedded diagnostics and other electronic components that were never even thought of by 1960's auto manufacturers -making the exponential increase and metamorphosis in electronics manufacturing quite clear. The never-ending desire for greater functionality and higher performance associated with electronics has forced designers to utilize novel, high density packaging technologies to provide theiI products with a competitive edge. Unfortunately, the use of an immature device packaging technology provides those responsible for manufacture of the electronics with an assembly and reliability related nightmare. The predominance of today's devices are being connected to substrates exhibiting .025" (25mil) pitch density or less. As can be seen in the following figure, this trend will continue to get worse as we approach the year 2000 [l].