Electronics Manufacturing Research At Rensselaer Polytechnic Institute

D. Millard, D. Knorr, L. Felton, S. Black
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引用次数: 1

Abstract

The 1990's has become the decade of electronics manufacturing. Never before has electronics been as major an element of nearly every product sector. For example, a 1992 automobile contains solid state ignition, computer-controlled fuel injection, automatic anti-skid braking, embedded diagnostics and other electronic components that were never even thought of by 1960's auto manufacturers -making the exponential increase and metamorphosis in electronics manufacturing quite clear. The never-ending desire for greater functionality and higher performance associated with electronics has forced designers to utilize novel, high density packaging technologies to provide theiI products with a competitive edge. Unfortunately, the use of an immature device packaging technology provides those responsible for manufacture of the electronics with an assembly and reliability related nightmare. The predominance of today's devices are being connected to substrates exhibiting .025" (25mil) pitch density or less. As can be seen in the following figure, this trend will continue to get worse as we approach the year 2000 [l].
伦斯勒理工学院电子制造研究
20世纪90年代已成为电子制造业的十年。电子产品从未像现在这样成为几乎所有产品部门的重要组成部分。例如,一辆1992年的汽车包含固态点火、计算机控制的燃油喷射、自动防滑制动、嵌入式诊断和其他电子元件,这些都是20世纪60年代汽车制造商从未想过的——这使得电子制造业的指数级增长和蜕变变得非常清楚。与电子产品相关的更大的功能和更高的性能的永无止境的愿望迫使设计师利用新颖,高密度的封装技术,为他们的产品提供竞争优势。不幸的是,使用不成熟的设备封装技术为那些负责制造电子产品的人提供了一个组装和可靠性相关的噩梦。今天的设备的优势是连接到基片显示0.025“(25mil)间距密度或更小。如下图所示,随着2000年的临近,这一趋势将继续恶化[1]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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