SKiN: Double side sintering technology for new packages

Abstract

SKiN technology comprises the sintering of power chips to a substrate (i.e. DBC), a top side sintering of the power chips to a flexible circuit board, and the sintering of the substrate to a pin-fin heat sink. The resulting power device has a very low volume and weight and demonstrates unprecedented thermal, electrical, and reliability performance. Therefore, this technology is ideally suited to provide better power electronic solutions for a range of applications, i.e. electric vehicles, renewable energies and variable speed motor drives. The process to manufacture a 400 Amp, 600 V Dual IGBT, sintered to an aluminum pin-fin heat sink will be described in detail and electrical, thermal and reliability results will be shown.