An Mcm-D Foundry from Copper/polyimid Tfml Bare Substrate to Multichif Modules

Abstract

Description of the process, based on copper conductors and polyimid as a dielectric* (1) Description of the industrial pilot (2) Process characterization (3) Let us briefly remind, as described by fig. 1 hereunder, that the technology allows the realization of a multilayer stack, with up to five levels of conductors for power, ground, two signal layers and a top layer, for components attach and interconnect.