Using nano-porous Au-Ag sheets as a joint layer for low-temperature Au-Au bonding

H. Mimatsu, J. Mizuno, T. Kasahara, M. Saito, H. Nishikawa, S. Shoji
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引用次数: 2

Abstract

In this research, we proposed low-temperature Au-Au bonding using nano-porous Au-Ag sheets as a joint layer. The influences of annealing temperature on the porous structure and chemical properties of the sheets were investigated. The nano-porous sheet was fabricated by dealloying a 100 μm thick Au-Ag sheet in solution HNO3. The nano-porous sheets were annealed between 100 °C and 250 °C. The chemical composition of the sheet was analyzed by using X-ray photoelectron spectroscopy (XPS). Two substrates and nano-porous sheet were bonded under a pressure of 8 MPa for 20 min. Bonding strengths were about 0.5 MPa, 1.0 MPa, 1.8 MPa, and 4.8 MPa at annealing temperatures of 100°C, 150°C, 200°C, and 250°C, respectively. The sheet which had about 10 nm ligament formed on the surface by additional treatment of immersing in liquid nitrogen was also used as a bonding layer. This treatment was effective to increase the bonding strength.
采用纳米多孔Au-Ag片作为低温Au-Au键合的连接层
在本研究中,我们提出了使用纳米多孔Au-Ag片作为连接层的低温Au-Au键合。研究了退火温度对薄膜多孔结构和化学性能的影响。将100 μm厚的Au-Ag薄片在HNO3溶液中合金化制备纳米孔片。在100 ~ 250℃之间进行退火处理。利用x射线光电子能谱(XPS)分析了薄片的化学成分。将两个衬底与纳米多孔片在8 MPa的压力下结合20 min,在100℃、150℃、200℃和250℃的退火温度下,结合强度分别为0.5 MPa、1.0 MPa、1.8 MPa和4.8 MPa左右。通过液氮浸泡处理在表面形成约10 nm韧带的薄片也被用作键合层。该处理能有效提高粘接强度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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