Non-uniform currents on vias and their effects in a parallel-plate environment

S. Muller, X. Duan, R. Rímolo-Donadío, H. Bruns, C. Schuster
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引用次数: 13

Abstract

This paper discusses the generation of non-uniform currents on vias and their impact on the field distribution at the via antipads as well as on the excitation of cavity modes supported by adjacent reference planes. It is shown that the influence of non-uniform currents can be relevant at frequencies above 10 GHz for typical printed circuit board dimensions. The contour integral method is applied to extract the current non-uniformity due to vias in close proximity. An identification of modes is carried out via a discrete Fourier transform. The energy content of the higher modes increases with frequency and via size. It is demonstrated by means of full-wave simulations that non-uniform via currents can lead to anisotropic electromagnetic fields in the antipad region and to the excitation of anisotropic cavity modes.
平行板环境下通孔上的非均匀电流及其影响
本文讨论了通孔上非均匀电流的产生及其对通孔反垫处场分布的影响,以及对相邻参考面支撑的腔模激励的影响。结果表明,对于典型的印刷电路板尺寸,非均匀电流的影响在10 GHz以上的频率上是相关的。采用轮廓积分法提取近距离过孔引起的电流不均匀性。模态的识别是通过离散傅里叶变换进行的。高阶模态的能量含量随频率和通孔尺寸的增加而增加。全波模拟表明,非均匀通流会导致反垫区产生各向异性电磁场,并激发各向异性腔模。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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