Modeling Automation System for Electronic Package Thermal Analysis using Excel Spreadsheet

Abstract

Thermal simulation and analysis play a significant role in development of new generation of IC package design. However, in general IC design engineers and package engineers do not have the skills of performing such simulation and analysis. One way of overcoming tins problem is to develop a tool which can perform thermal analysis on package models automatically. Based on tins idea, a customized tool called WBExcel is developed with ANSYS workbench and Excel. It is easy for user to input necessary data in an intuitive Excel spreadsheet. After that the whole thermal simulation (including meshing, loading/boundary condition, solving, post-process and thermal results) will be completed automatically and efficiently. Tins paper introduces the general methodology of the simulation interface and system. This simulation tool has been applied to MLP package family and the results agree well with those from the normal ANSYS simulation and measurement.