Effect of Contact Parameters on Current Density Distribution in a Contact Interface

M. Myers, M. Leidner, H. Schmidt
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引用次数: 15

Abstract

The distribution of individual current paths within a smooth mated surface contact interface results in the areas of highest current density being located at the outer rim of the contact interface. As contact surface roughness increases, the areas of highest current density become more evenly distributed across the contact interface, though still biased toward the outer rim. This effect can be predicted using a 3-dimensional simulation visualization technique and validated experimentally. The tech-nique used for experimental validation involves using thermal camera technology to directly view the thermal response of the material within a contact interface. This is done as a volt-age/current pulse is applied across a plated electrical contact surface mated to an appropriate probe surface. These results are then used to visualize the resulting effect on the current density distribution. This work focuses on the further development and application of the simulation tool and thermal observation tech-nique to be able to better quantify contact interface thermal per-formance with respect to multiple contact parameters.
接触参数对接触界面电流密度分布的影响
单个电流路径在光滑的表面接触界面内的分布导致电流密度最高的区域位于接触界面的外缘。随着接触面粗糙度的增加,电流密度最高的区域在接触界面上分布更加均匀,尽管仍然偏向外缘。这种效应可以用三维模拟可视化技术预测,并通过实验验证。用于实验验证的技术包括使用热像仪技术直接查看接触界面内材料的热响应。这是通过将电压/电流脉冲施加于与适当探头表面匹配的电镀电接触表面来完成的。这些结果然后用于可视化对电流密度分布产生的影响。本工作的重点是进一步开发和应用模拟工具和热观测技术,以便能够更好地量化涉及多个接触参数的接触界面热性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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