{"title":"A CMOS-MEMS lateral-axis gyroscope","authors":"Huikai Xie, G. Fedder","doi":"10.1109/MEMSYS.2001.906505","DOIUrl":null,"url":null,"abstract":"This paper reports on the experimental results from the first design of a CMOS lateral-axis vibratory gyroscope that utilizes comb fingers for both actuation and sensing. The fabrication is compatible with standard CMOS processes and the design has an integrated, fully-differential capacitive interface circuit. This gyroscope design uses integrated comb drives for out-of-plane actuation, and is motivated by the desire to integrate three-axis gyroscopes on a single chip. The packaged gyroscope operates at atmospheric pressure with a sensitivity of 0.12 mV/deg/s and the resonant frequency of the drive mode is thermomechanically tuned between 4.2-5.1 kHz. Resonant frequency matching between the drive and sense modes is realized by integrating a polysilicon heater inside the spring beams.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"47","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2001.906505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 47
Abstract
This paper reports on the experimental results from the first design of a CMOS lateral-axis vibratory gyroscope that utilizes comb fingers for both actuation and sensing. The fabrication is compatible with standard CMOS processes and the design has an integrated, fully-differential capacitive interface circuit. This gyroscope design uses integrated comb drives for out-of-plane actuation, and is motivated by the desire to integrate three-axis gyroscopes on a single chip. The packaged gyroscope operates at atmospheric pressure with a sensitivity of 0.12 mV/deg/s and the resonant frequency of the drive mode is thermomechanically tuned between 4.2-5.1 kHz. Resonant frequency matching between the drive and sense modes is realized by integrating a polysilicon heater inside the spring beams.