High Performance Multi-Chip Leadframe Package with Internal Connection

Abstract

This paper discusses a highly integrated multi -chip module (MCM) routable (thin) MicroLeadFrame® (rtMLF®) packaging for multi-functional high-performance applications. The MCM rtMLF package includes internal routing leads to connect die to die within the package. These routing leads let the package enhance the small form factor and are compared with two single quad flat no-lead (QFN) packages where the dice were connected by board traces. Feasibility of the MCM rtMLF package was confirmed using a conventional QFN-process and the MCM rtMLF package passed the Automotive Electronics Council Q006 (AEC-Q006) reliability test. Die to die interconnections through routing leads showed higher electric performances in terms of resistance, inductance, capacitance parasitic and insertion loss than the on-board interconnections of the two single QFN packages. Lastly, thermal resistances of the MCM rtMLF package measured by thermal simulation were lower than those of MCM two-layer chip scale packages (CSPs).