{"title":"The impact of ion implantation on VLSI","authors":"H. Ryssel","doi":"10.1109/IEDM.1978.189483","DOIUrl":null,"url":null,"abstract":"In this paper problems concerned with the application of ion implantation to VLSI technology are discussed. The problems discussed involve segregation, oxidation, diffusion, lateral spread, and as new applications of ion implantation gettering, local oxidation, buried layers, damage etching, and beam writing.","PeriodicalId":164556,"journal":{"name":"1978 International Electron Devices Meeting","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1978 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1978.189483","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper problems concerned with the application of ion implantation to VLSI technology are discussed. The problems discussed involve segregation, oxidation, diffusion, lateral spread, and as new applications of ion implantation gettering, local oxidation, buried layers, damage etching, and beam writing.