Ultra-thin chips for flexible electronics

2013 IEEE International Conference of Electron Devices and Solid-state Circuits Pub Date : 2013-06-03 DOI:10.1109/EDSSC.2013.6628168

J. Burghartz, E. Angelopoulos, W. Appel, S. Endler, S. Ferwana, C. Harendt, M. Hassan, H. Rempp, H. Richter, M. Zimmermann

引用次数: 0

Abstract

Various aspects of ultra-thin chip technology for flexible electronics based on Chipfilm™ technology are presented and discussed, including ultra-thin-chip fabrication, mechanical and electrical characterization, as well as chip assembly and imbedding.

查看原文本刊更多论文

用于柔性电子产品的超薄芯片

介绍并讨论了基于Chipfilm™技术的柔性电子产品超薄芯片技术的各个方面，包括超薄芯片制造，机械和电气特性，以及芯片组装和嵌入。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2013 IEEE International Conference of Electron Devices and Solid-state Circuits

自引率

0.00%

发文量