Copy smart technology transfer

D. Tucker, P. Fearon, M. Landry, J. Rock
{"title":"Copy smart technology transfer","authors":"D. Tucker, P. Fearon, M. Landry, J. Rock","doi":"10.1109/ISSM.2007.4446824","DOIUrl":null,"url":null,"abstract":"Transferring technologies among factories is a common practice. Numerous factors which drive this include: adding a second source, consolidating technologies, purchasing processes, and adding capacity for new processes. Transferring facilities can be company to company; site to site within a manufacturer; from old to new tool sets; small to larger wafer sizes and include other complicating scenarios. At National Semiconductor, recent transfers involved existing technologies among three fabrication sites. In this paper the evolved transfer process is reviewed along with a discussion of obstacles, methods to counter these issues and best practice techniques.","PeriodicalId":325607,"journal":{"name":"2007 International Symposium on Semiconductor Manufacturing","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 International Symposium on Semiconductor Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2007.4446824","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Transferring technologies among factories is a common practice. Numerous factors which drive this include: adding a second source, consolidating technologies, purchasing processes, and adding capacity for new processes. Transferring facilities can be company to company; site to site within a manufacturer; from old to new tool sets; small to larger wafer sizes and include other complicating scenarios. At National Semiconductor, recent transfers involved existing technologies among three fabrication sites. In this paper the evolved transfer process is reviewed along with a discussion of obstacles, methods to counter these issues and best practice techniques.
复制智能技术转让
在工厂之间转移技术是一种常见的做法。驱动这一过程的许多因素包括:增加第二个来源,整合技术,购买过程,以及增加新过程的能力。设备转移可以是公司间的;在一个制造商内部的现场到现场;从旧工具集到新工具集;小到更大的晶圆尺寸,包括其他复杂的场景。在国家半导体公司,最近的转让涉及三个制造基地之间的现有技术。在这篇文章中,我们回顾了不断发展的迁移过程,并讨论了障碍、应对这些问题的方法和最佳实践技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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