Enhanced chip/package design for the IBM ES/9000

[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors Pub Date : 1991-10-14 DOI:10.1109/ICCD.1991.139969

R. Belanger, David P. Conrady, P. S. Honsinger, T. Lavery, S. J. Rothman, Erich C. Schanzenbach, D. Sitaram, C. Selinger, R. E. DuBois, G. W. Mahoney, G. Miceli

引用次数: 3

Abstract

The automatic placement and wiring programs used for design of the gate array bipolar chips, the TCM logical design optimization for timing, and the automated module wiring programs of the ES/9000 machines are described. An overview of related aspects of the chip and module technologies is given.<>

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针对IBM ES/9000的增强芯片/封装设计

介绍了用于门阵列双极芯片设计的自动布线程序、时序的TCM逻辑设计优化以及ES/9000机器模块的自动布线程序。对芯片和模块技术的相关方面进行了概述

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors

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